MAX19792ETX+【PDF 15/23 页】ATTENUATR 46DB 50OHM 4GHZ 36TQFN

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Sheet目录55

11页 12页 13页 14页 [15页]16页 17页 18页 19页

Maxim Integrated

MAX19792

500MHz to 4000MHz Dual Analog Voltage Variable

Attenuator with On-Chip 10-Bit SPI-Controlled DAC

Pin Description (continued)

NAME

DESCRIPTION

Analog Supply Voltage. Bypass to GND with a capacitor as close as possible to the device. See

the Typical Application Circuit.

REF_IN

DAC Reference Voltage Input (Optional)

REF_SEL

DAC Reference Voltage Selection Logic Input

Logic = 0 to enable on-chip DAC reference.

Logic = 1 to use off-chip DAC reference (pin 14).

DAC_LOGIC DAC Logic Control Input (Table 1)

COMP_OUT

Comparator Logic Output. Use a 4.7pF capacitor to reduce any potential rise-time glitching

when the comparator changes state.

MODE

Attenuator Control Mode Logic Input

Logic = 1 to enable attenuator step control.

Logic = 0 to enable attenuator SPI control.

DWN

Down Pulse Input

Logic pulse = 0 for each step-down.

Up Pulse Input

Logic pulse = 0 for each step-up.

19/20

DWN/UP

Logic = 0 to both pins to reset the attenuator to a minimum attenuation state

CLK

SPI Clock Input

DIN

SPI Data Input

DOUT

SPI Data Output

SPI Chip-Select Input

Digital Supply Voltage. Bypass to GND with a capacitor as close as possible to the device.

See the Typical Application Circuit.

OUT_B

Attenuator B RF Output. Internally matched to 50I over the operating frequency band. This pin,

if used, requires a DC block. If this attenuator is not used, the pin can be left unconnected.

Attenuator B Power Supply. Bypass to GND with a capacitor and resistor, as shown in the

Typical Application Circuit.

IN_B

Attenuator B RF Input. Internally matched to 50I over the operating frequency band. This pin,

if used, requires a DC block. If this attenuator is not used, the pin can be left unconnected.

Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses

multiple ground vias to provide heat transfer out of the device into the PCB ground planes.

These multiple via grounds are also required to achieve the noted RF performance. See the

Layout Considerations section.

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